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Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
Electroless copper plates uniformly over all surfaces, regardless of size and shape, demonstrating 100 percent throwing power; it may be plated onto non-conduc- tors, or conductive surfaces that do not share electrical continuity. The ability to plate large racks of substrates simultaneously is also an advantage in certain instances.
Electroless deposition (ED) or electroless plating is defined as the autocatalytic process through which metals and metal alloys are deposited onto conductive and nonconductive surfaces.
Chapter 12 Fundamental Aspects of Electroless Copper Plating. Perminder Bindra and James R. White. When an iron substrate is immersed in a solution of copper sulfate or silver nitrate, the iron dissolves while the copper or silver is plated out onto the surface of the substrate. This is called immersion plating.
The electroless deposi- tion of gold and its alloys is treated thor- oughly in light of its importance in elec- tronic applications. The chapter covers the many successful pure gold bath for- mulations and their applications, as well as alloys with silver, copper and tin.
Electroless copper plating is widely used for the fabrica-tion of printed circuit boards and other electronic devices. Electroless copper can provide a seed layer on a dielectric material for subsequent acid copper electroplating. 1,2 There is renewed interest in copper deposition for ultra-large scale integrated circuits (ULSI) because of the ...
environmentally friendly ligands for electroless copper baths is promising. Electroless copper plating solutions containing the chelators such as xylitol, D-mannitol and D-sorbitol are stable and under optimal conditions, copper coatings up to 3 µm thick can be obtained in 1 h at ambient temperatures [34-35]. Xylitol forms three mononuclear copper
This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications.
The principle of electroless copper plating technology and its application status and production process in through-hole metallization, inner copper foil treatment, electronic packaging technology and electromagnetic wave shielding in printed circuit board (PCB) are briefly introduced.
Main advantage of electroless plating is that uniform deposits can be achieved, unlike electroplating which is uneven. Electroless coatings will penetrate into narrow through and blind holes, provided these are positioned so that there is no gas entrapment.