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The EPA started a short-term cleanup in fall of 2011, removing 233 drums of industrial waste and 6,100 gallons of chromium-contaminated water from the site. From 2012 through 2014, the EPA demolished the E.C Electroplating building, and contaminated soils and concrete from the site were excavated and removed.
The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working electrode). The term "electroplating" is also used occasionally for processes that occur under electro-oxidation (i.e positive or anodic current on the working electrode), although such processes are more ...
Electrowinning, the extraction of metal from ores [2] Electrorefining, the purification of metals. [2] Metal powder production by electrodeposition is included in this category, or sometimes electrowinning, or a separate category depending on application. [2] Electroplating, the deposition of a layer of one metal on another [2]
Chemical coloring of metals is the process of changing the color of metal surfaces with different chemical solutions. The chemical coloring of metals can be split into three types: electroplating – coating the metal surface with another metal using electrolysis. patination – chemically reacting the metal surface to form a colored oxide or ...
Electrochemical coloring of metals is a process in which the surface color of metal is changed by electrochemical techniques, i.e. cathodic or anodic polarization. The first method of electrochemical coloring of metals are certainly Nobili's colored rings, discovered by Leopoldo Nobili , an Italian physicist in 1826.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
This creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven current density due to the effect of substrate shape on the electric resistance of the bath and therefore on the current distribution within it. [2] Moreover, it can be applied to non-conductive surfaces.