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USB-C, or USB Type-C, is a 24-pin, reversible connector (not a protocol) that supersedes previous USB connectors and can carry audio, video, and other data, to connect to monitors, external drives, hubs/docking stations, mobile phones, and many more peripheral devices. It can also provide and receive power, to power, e.g., a laptop or a mobile ...
COM Express Type 6 Module VIA COMe-8X92 with VIA Nano X2 COM Express Carrier Board. COM Express is a form factor for computer-on-modules (COMs), which are highly integrated and compact computers that can be used in design applications much like integrated circuit components.
VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.
The benchmark software used had been released before the release of VIA Nano. [11] On November 3, 2009, VIA launched the Nano 3000 series. VIA claims that these models can offer a 20% performance boost and 20% more energy efficiency than the Nano 1000 and 2000 series. [12] Benchmarks run by VIA claim that a 1.6 GHz 3000-series Nano can ...
Developed at roughly the same time as the USB 3.1 specification, but distinct from it, the USB-C Specification 1.0 was finalized in August 2014 [26] and defines a new small reversible-plug connector for USB devices. [27] The USB-C plug connects to both hosts and devices, replacing various Type-A and Type-B connectors and cables with a standard ...
Series Model Core Frequency [MHz] Front-side bus [MHz] Year Process [nm] Package size [mm 2] Power [W] L2 cache [K] L1 I/D cache [K] Performance [SPEC2000]
That same year, VIA acquired Centaur Technology from Integrated Device Technology, marking its entry into the x86 microprocessor market. VIA is the maker of the VIA C3, VIA C7 & VIA Nano processors, and the EPIA platform. The Cyrix MediaGX platform remained with National Semiconductor. In 2001, VIA established the S3 Graphics joint venture.
USB 3.0 and later specifications define one dedicated pair for USB 2.0 compatibility and two or four pairs for data transfer: two data wire pairs realising full-duplex (FDx) for single lane (×1) variants require at least SuperSpeed (SS) connectors; four pairs realising full-duplex for two lane (×2) variants require USB-C connectors.
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