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PCB warning label on a power transformer known to contain PCBs. Polychlorinated biphenyls (PCBs) are organochlorine compounds with the formula C 12 H 10−x Cl x; they were once widely used in the manufacture of carbonless copy paper, as heat transfer fluids, and as dielectric and coolant fluids for electrical equipment. [2]
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
This is a complete list of polychlorinated biphenyl (PCB) congeners. Chemical structure of PCBs. The possible positions of chlorine atoms on the benzene rings are denoted by numbers assigned to the carbon atoms.
A group of carcinogenic organic compounds, polychlorinated biphenyls (PCBs), is an example of a congener grouping. The number and locations of Cl groups can vary. In chemistry, congeners are chemical substances "related to each other by origin, structure, or function". [1]
Exposure to the coplanar stereoisomer 3,3',4,4',5,5'-hexabromobiphenyl (but not the non-coplanar stereoisomer) in genetically susceptible mice is known to cause immunotoxicity and disorders related to the central nervous system, and even at doses as low as 2.5 mg/kg, excess neonatal fatalities are observed (LD 50 is from 5–10 mg/kg). [1]
An organic nuclear reactor, or organic cooled reactor (OCR), is a type of nuclear reactor that uses some form of organic fluid, typically a hydrocarbon substance like polychlorinated biphenyl (PCB), for cooling and sometimes as a neutron moderator as well. Using an organic fluid had a major advantage over conventional designs using water as the ...
Plasma etching is a form of plasma processing used to fabricate integrated circuits.It involves a high-speed stream of glow discharge of an appropriate gas mixture being shot (in pulses) at a sample.
Miniaturization of various devices presents challenges in many areas of science and engineering: physics, chemistry, materials science, computer science, ultra-precision engineering, fabrication processes, and equipment design.