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  2. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  3. Moisture sensitivity level - Wikipedia

    en.wikipedia.org/wiki/Moisture_sensitivity_level

    Moisture sensitivity level (MSL) is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. It relates to the packaging and handling precautions for some semiconductors.

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.

  5. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    This standard codified information from, among other sources, a United States military standard MIL-STD-16 which dates back to at least the 1950s in American industry. To replace IEEE 200-1975, ASME, a standards body for mechanical engineers, initiated the new standard ASME Y14.44-2008. This standard, along with IEEE 315-1975, provide the ...

  6. Talk:Soldering - Wikipedia

    en.wikipedia.org/wiki/Talk:Soldering

    For what it's worth, the IPC (general industry and military standard) J-STD-001 Handbook says that ROM1 fluxes (Kester RA "44") do not need to be cleaned for class 1 electronics: consumer electronics that will not cause major loss of money or life if they fail.

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.

  8. US agents raid New Jersey worksite as Trump escalates ...

    www.aol.com/news/us-agents-raid-jersey-business...

    WASHINGTON (Reuters) -U.S. immigration agents rounded up undocumented migrants as well as American citizens in a raid of a Newark, New Jersey, worksite on Thursday that the city's mayor said ...

  9. Joint Electronics Type Designation System - Wikipedia

    en.wikipedia.org/wiki/Joint_Electronics_Type...

    The Japan Self-Defense Forces use a similar system that replaces the "AN/" prefix with "J/". Equipment sharing the same designation may or may not be equivalent. For example, the J/AWG-12 fitted on the Mitsubishi F-1 is said to be closely related to the AN/AWG-12, [3] but the 1990s J/APG-1 is clearly different from the 1940s AN/APG-1 on the P-61B.