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Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
Eight-contact DIP switch with 0.3" wide 16-pin (DIP16N) footprint. In microelectronics, a dual in-line package (DIP or DIL) [1] is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts. Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the ...
The SN7400N chip contains four two-input NAND gates. The SN prefix indicates it was manufactured by Texas Instruments [1] The N suffix is a vendor-specific code indicating plastic DIP packaging. The second line of numbers (7645) is a date code; this chip was manufactured in the 45th week of 1976. [2]
ATmega328 P in 28-pin narrow dual in-line package (DIP -28N). It is commonly found on Arduino boards. AVR is a family of microcontrollers developed since 1996 by Atmel, acquired by Microchip Technology in 2016. These are modified Harvard architecture 8-bit RISC single-chip microcontrollers.
A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.
Various older (EPROM) PIC microcontrollers. The original PIC was intended to be used with General Instrument's new CP1600 16-bit central processing unit (CPU). In order to fit 16-bit data and address buses into a then-standard 40-pin dual inline package (DIP) chip, the two buses shared the same set of 16 connection pins.
WDC 65C816. The MOS Technology 6502 (typically pronounced "sixty-five-oh-two" or "six-five-oh-two") [3] is an 8-bit microprocessor that was designed by a small team led by Chuck Peddle for MOS Technology. The design team had formerly worked at Motorola on the Motorola 6800 project; the 6502 is essentially a simplified, less expensive and faster ...