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FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material. FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant ( self-extinguishing ).
CEM-3 is very similar to the most commonly used PCB material, FR-4. Its color is white, and it is flame-retardant. [5] CEM-4 quite similar to CEM-3 but not flame-retardant. CEM-5 (also called CRM-5) has polyester woven glass core. [6]
This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. [1] Silicon and glass are also evaluated as an integration method. [ 6 ] [ 7 ] Interposer stacks are also a widely accepted, cost-effective alternative to 3D ICs .
PCB-Investigator is a software tool used for the analysis, visualization, and optimization of printed circuit boards (PCBs). It is used for tasks such as PCB design validation and quality assurance. It is developed by EasyLogix [1] owned by Schindler & Schill GmbH, a German company specializing in electronic design automation (EDA) software.
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
FR-2 sheet with copper foil lamination on one or both sides is widely used to build low-end consumer electronics equipment. While its electrical and mechanical properties are inferior to those of epoxy-bonded fiberglass, FR-4, it is significantly cheaper.
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