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X-ray picture of inadequate solder joints. Rework is practiced in many kinds of manufacturing when defective products are found. [2] For electronics, defects may include: Poor solder joints because of faulty assembly or thermal cycling. Solder bridges—unwanted drops of solder that connect points that should be isolated from each other.
A typical spring-loaded solder sucker A solder sucker partially dismantled showing the spring. A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1]
Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations , or mechanical loads .
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
A ball valve is a flow control device which uses a hollow, perforated, and pivoting ball to control fluid flowing through it. It is open when the hole through the middle of the ball is in line with the flow inlet, and closed when it is pivoted 90 degrees by the valve handle, blocking the flow. [1]
The joint is then heated, typically by using a propane or MAPP gas torch, although electrically heated soldering tools are sometimes used. Once the fitting and pipe have reached sufficient temperature, solder is applied to the heated joint, and the molten solder is drawn into the joint by capillary action as the flux vaporizes. "Sweating" is a ...
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