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  2. List of AMD Ryzen processors - Wikipedia

    en.wikipedia.org/wiki/List_of_AMD_Ryzen_processors

    Release date Fab CPU GPU Memory support TDP Junction temp. range (°C) Cores Clock rate Cache Model Config [i] Clock (GHz) Processing power [ii] Base Boost L1 L2 L3; V1202B: February 2018 GloFo 14LP: 2 (4) 2.3 3.2 64 KB inst. 32 KB data per core: 512 KB per core: 4 MB Vega 3 192:12:16 3 CU 1.0 384 DDR4-2400 dual-channel: 12–25 W 0–105 ...

  3. RDNA 3 - Wikipedia

    en.wikipedia.org/wiki/RDNA_3

    The decision to move to a chiplet-based GPU microarchitecture was led by AMD Senior Vice President Sam Naffziger who had also lead the chiplet initiative with Ryzen and Epyc. [6] The development of RDNA 3's chiplet architecture began towards the end of 2017 with Naffziger leading the AMD graphics team in the effort. [ 7 ]

  4. CDNA (microarchitecture) - Wikipedia

    en.wikipedia.org/wiki/CDNA_(microarchitecture)

    CDNA (Compute DNA) is a compute-centered graphics processing unit (GPU) microarchitecture designed by AMD for datacenters. Mostly used in the AMD Instinct line of data center graphics cards, CDNA is a successor to the Graphics Core Next (GCN) microarchitecture; the other successor being RDNA (Radeon DNA), a consumer graphics focused microarchitecture.

  5. RDNA 2 - Wikipedia

    en.wikipedia.org/wiki/RDNA_2

    At AMD's Financial Analysts Day held on March 5, 2020, AMD showed a client GPU roadmap that gave details on RDNA's successor, RDNA 2, that it would again be built using TSMC's 7 nm process and would be coming in 2020. [3] AMD told their investors that they were targeting a 50% uplift in performance-per-watt and increased IPC with the RDNA 2 ...

  6. ROCm - Wikipedia

    en.wikipedia.org/wiki/ROCm

    ROCm [3] is an Advanced Micro Devices (AMD) software stack for graphics processing unit (GPU) programming. ROCm spans several domains: general-purpose computing on graphics processing units (GPGPU), high performance computing (HPC), heterogeneous computing.

  7. List of AMD graphics processing units - Wikipedia

    en.wikipedia.org/wiki/List_of_AMD_graphics...

    Launch – Date of release for the GPU. Architecture – The microarchitecture used by the GPU. Fab – Fabrication process. Average feature size of components of the GPU. Transistors – Number of transistors on the die. Die size – Physical surface area of the die. Core config – The layout of the graphics pipeline, in terms of functional ...

  8. Template:AMD Ryzen 3000 series - Wikipedia

    en.wikipedia.org/wiki/Template:AMD_Ryzen_3000_Series

    Release date MSRP; Base Boost Ryzen 9 3950X: 16 (32) N/A 3.5 4.7 64 MB 105 W [iii] 2 × CCD 1 × I/OD: 4 × 4 Nov 25, 2019: US $749 3900XT: 12 (24) 3.8 4 × 3 Jul 7, 2020: US $499 3900X: Wraith Prism: 4.6 Jul 7, 2019: 3900 [a] OEM 3.1 4.3 65 W Oct 8, 2019: OEM Ryzen 7 3800XT: 8 (16) N/A 3.9 4.7 32 MB 105 W 1 × CCD 1 × I/OD: 2 × 4 Jul 7, 2020 ...

  9. RDNA (microarchitecture) - Wikipedia

    en.wikipedia.org/wiki/RDNA_(microarchitecture)

    RDNA 3 (also RDNA3) is the successor to the RDNA 2 microarchitecture and was projected for a launch in Q4 2022 per AMD's gaming GPU roadmap. [46] [47] [48] At an August 29 reveal event for Ryzen 7000 series CPUs, AMD CEO Lisa Su teased RDNA 3 and revealed that it would utilize chiplets built on TSMC's N5 node. [49]