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2. Polishing (metalworking) - Wikipedia

   en.wikipedia.org/wiki/Polishing_(metalworking)

   Buffing may be done by hand with a stationary polisher or die grinder, or it may be automated using specialized equipment. When buffing there are two types of buffing motions: the cut motion and the color motion. The cut motion is designed to give a uniform, smooth, semi-bright surface finish.

3. Waxed paper - Wikipedia

   en.wikipedia.org/wiki/Waxed_paper

   Natural wax was largely replaced for the making of waxed paper (or paraffine paper) after Herman Frasch developed ways of purifying paraffin and coating paper with it in 1876. [2] Waxed paper is commonly used in cooking for its non-stick properties, and wrapping food for storage, such as cookies , as it keeps water out or in.

4. Scotch-Brite - Wikipedia

   en.wikipedia.org/wiki/Scotch-Brite

   Scotch-brite. Scotch-Brite is a line of abrasive products produced by 3M.The product line includes scouring pads and tools for home uses such as dish washing and scrubbing, as well as various types of surfaces for industrial applications, such as discs, belts, and rotating brushes, with varying compositions and levels of hardness.

5. Polishing - Wikipedia

   en.wikipedia.org/wiki/Polishing

   Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]

6. How To Clean Enameled Cast Iron To Remove Stains And Stuck-On ...

   www.aol.com/clean-enameled-cast-iron-remove...

   Avoid using any type of metal tool or spatula to scrape the surface. Metal can scratch or damage the enamel finish, leading to more damage. Soft silicone is always better for scraping stuck-on ...

7. Chemical-mechanical polishing - Wikipedia

   en.wikipedia.org/wiki/Chemical-mechanical_polishing

   The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring.