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  2. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  3. Simultaneous multithreading - Wikipedia

    en.wikipedia.org/wiki/Simultaneous_multithreading

    Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures .

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Download as PDF; Printable version ... Integrated circuit packaging is the last assembly process before testing ... [24] Also called D2PAK: SMT package similar to the ...

  5. Depaneling - Wikipedia

    en.wikipedia.org/wiki/Depaneling

    Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.

  6. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Internal details of a two head, gantry style pick-and-place JUKI SMT machine. In the foreground are tape and reel feeders, then the (currently empty) conveyor belt for printed circuit boards, and in back are large parts in a tray. The gantry carries two pickup nozzles, flanking a camera (marked "do not touch" to avoid fingerprints on the lens).

  7. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    The development of the SMT process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for miniaturization of the circuits as all the extra encapsulation is not necessary.

  8. Hyper-threading - Wikipedia

    en.wikipedia.org/wiki/Hyper-threading

    A 3 GHz model of the Intel Pentium 4 processor that incorporates Hyper-Threading Technology [7]. Hyper-Threading Technology is a form of simultaneous multithreading technology introduced by Intel, while the concept behind the technology has been patented by Sun Microsystems.

  9. Selective soldering - Wikipedia

    en.wikipedia.org/wiki/Selective_soldering

    Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.