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  2. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a ...

  3. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    The development of the SMT process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for miniaturization of the circuits as all the extra encapsulation is not necessary.

  4. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Internal details of a two head, gantry style pick-and-place JUKI SMT machine. In the foreground are tape and reel feeders, then the (currently empty) conveyor belt for printed circuit boards, and in back are large parts in a tray. The gantry carries two pickup nozzles, flanking a camera (marked "do not touch" to avoid fingerprints on the lens).

  5. Simultaneous multithreading - Wikipedia

    en.wikipedia.org/wiki/Simultaneous_multithreading

    Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures.

  6. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively).

  7. Integrated passive devices - Wikipedia

    en.wikipedia.org/wiki/Integrated_passive_devices

    IPDs (IPCs) Single SMT chip solutions for Bandpass, Lowpass, HighPass, and other combinations based on LC, RC etc. integrated networks on a ceramic substrate Integrated passives (resistors and capacitors) on high resistive silicon substrate coated by thick silicon dioxide Active IC flipped as face down on the integrated passive substrate enabling 2D integration Example of RF IPD balun on Glass ...

  8. Selective soldering - Wikipedia

    en.wikipedia.org/wiki/Selective_soldering

    Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.

  9. Reflow oven - Wikipedia

    en.wikipedia.org/wiki/Reflow_oven

    A convection reflow oven. A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs).. In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel.