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The addition of a high-speed switching system to a test system's configuration allows for faster, more cost-effective testing of multiple devices, and is designed to reduce both test errors and costs. Designing a test system's switching configuration requires an understanding of the signals to be switched and the tests to be performed, as well ...
Pitch for a 300 mm FOUP is 10 mm, while 13 slot FOUPs can have a pitch up to 20 mm. The weight of a fully loaded 25 wafer FOUP is between 7 and 9 kilograms which means that automated material handling systems are essential for all but the smallest of fabrication plants.
The steps involving testing and packaging of dies, followed by final testing of finished, packaged chips, are called the back end, [118] post-fab, [192] ATMP (Assembly, Test, Marking, and Packaging) [193] or ATP (Assembly, Test and Packaging) of semiconductor manufacturing, and may be carried out by OSAT (OutSourced Assembly and Test) companies ...
In August 2009, the wholly owned subsidiary, Muratec Automation Co. Ltd., was established when Murata Machinery split the business unit for Automated Material Handling Systems for Semiconductor and FPD and acquired Asyst Technology Japan and then integrated these business units.
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.
The company’s semiconductor products include automated ultra-thin wafer dicing and high-throughput, high-accuracy grooving systems. [44] In the area of component test and inspection, ESI offers automated test, termination, high-speed handling and visual inspection equipment for manufacturing of miniature multilayer ceramic passive components ...
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