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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Aluminum is also much lighter than copper, offering less mechanical stress on delicate electronic components. Some heat sinks made from aluminum have a copper core as a trade off. The heat sink's contact surface (the base) must be flat and smooth to ensure the best thermal contact with the object needing cooling.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is ...
Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]
A Cooler Master computer heat sink has many heat pipes. CPU cooler Thermalright Le Grand Macho RT installed into the computer case. Air cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both.
A multi-surface cooler is a sub-type of passive cooler. It allows airflow both between the laptop base and cooler, and between the base of the cooler and the user's lap. These laptop coolers are suitable for laptops that have vents on the underside. The multi-surface cooling design typically works on any surface without blocking any vents.
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