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SparkFun ESP8266 Thing. The reason for the popularity of many of these boards over the earlier ESP-xx modules is the inclusion of an on-board USB-to-UART bridge (like the Silicon Labs' CP2102 or the WCH CH340G) and a Micro-USB connector, coupled with a 3.3-volt regulator to provide both power to the board and connectivity to the host (software development) computer – commonly referred to as ...
Serial communication on pin D0 (RX) and pin D1 (TX). used to receive (RX) and transmit (TX) TTL serial data. These pins are connected to the corresponding pins of the FTDI USB-to-TTL Serial chip. By sliding the switch (S1), RX/TX pins can be re-routed to Bluetooth UART connector. Linduino One Linear Technology Corporation [60] Yes ATmega328 16 MHz
On December 30, 2013, Espressif Systems [6] began production of the ESP8266. [12] NodeMCU started on 13 Oct 2014, when Hong committed the first file of nodemcu-firmware to GitHub. [ 13 ] Two months later, the project expanded to include an open-hardware platform when developer Huang R committed the gerber file of an ESP8266 board, named devkit ...
Serial communication on pin D0 (RX) and pin D1 (TX). used to receive (RX) and transmit (TX) TTL serial data. These pins are connected to the corresponding pins of the FTDI USB-to-TTL serial chip. By sliding the switch (S1), RX/TX pins can be re-routed to Bluetooth UART connector. Linduino One ATmega328 Linear Technology Corporation [70]
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
Pin-to-pin compatible devices share an assignment of functions to pins, but may have differing electrical characteristics (supply voltages, or oscillator frequencies) or thermal characteristics (TDPs, reflow curves, or temperature tolerances). As a result, their use in a system may require that portions of the system, such as its power delivery ...
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Another SOIC variant, available only for 8-pin and 10-pin ICs, is the mini-SOIC, also called micro-SOIC. This case is much smaller, with a pitch of only 0.5 mm. See the table for the 10-pin model. An excellent overview of different semiconductor packages is provided by National Semiconductor. [2]