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Online heat sink calculators from companies such as Novel Concepts, Inc. and at www.heatsinkcalculator.com [7] can accurately estimate forced and natural convection heat sink performance. For more complex heat sink geometries, or heat sinks with multiple materials or multiple fluids, computation fluid dynamics (CFD) analysis is recommended (see ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]
Sometimes it is not feasible or economical to change the first two options. Thus, adding a fin to an object, increases the surface area and can sometimes be an economical solution to heat transfer problems. One-piece finned heat sinks are produced by extrusion, casting, skiving, or milling.
is the absolute thermal resistance of the heat sink. The heat flow can be modelled by analogy to an electrical circuit where heat flow is represented by current, temperatures are represented by voltages, heat sources are represented by constant current sources, absolute thermal resistances are represented by resistors and thermal capacitances ...
Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling ...
The above equation only takes into account the temperature differences and ignores two important parameters, being 1) solar radiative flux; and 2) infrared exchanges from the sky. The concept of T sol-air was thus introduced to enable these parameters to be included within an improved calculation. The following formula results: