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Derived from the EEB and ATX specifications. This means that SSI CEB motherboards have the same mounting holes and the same IO connector area as ATX motherboards, but SSI EEB motherboards do not. SSI MEB: SSI? 411 × 330 mm (16.2 × 13 in) Created by the Server System Infrastructure (SSI) forum. Derived from the EEB and ATX specifications. microATX
The HX processors only support: DDR5-4800 (DDR5-5600 for i7-13850HX and above), DDR4-3200. The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7), Core 3-, Core 5-, and Core 7-branded processors.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
Fujitsu (its ARM-based CPU used in top supercomputer, still also sells its SPARC-based servers) Hitachi (its own designs and ARM) Hygon Information Technology (x86-based) Loongson (MIPS-based) HiSilicon (acquired by Huawei), stopped making its ARM-based design; IBM (now only designs two architectures) Ingenic Semiconductor (MIPS-based)
VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.
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released November 17, 2008, built on a 45 nm process and used in the Core i7, Core i5, Core i3 microprocessors. Incorporates the memory controller into the CPU die. Added important powerful new instructions, SSE4.2. Westmere: 32 nm shrink of the Nehalem microarchitecture with several new features. Sandy Bridge
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