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The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
A multi-surface cooler is a sub-type of passive cooler. It allows airflow both between the laptop base and cooler, and between the base of the cooler and the user's lap. These laptop coolers are suitable for laptops that have vents on the underside. The multi-surface cooling design typically works on any surface without blocking any vents.
In general, heat pumps work most efficiently (that is, the heat output produced for a given energy input) when the difference between the heat source and the heat sink is small. When using a heat pump for space or water heating, therefore, the heat pump will be most efficient in mild conditions, and decline in efficiency on very cold days.
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Even with a common heat sink and fan attached, typical processor operating temperatures may still reach up to 70 °C (160 °F). A thermosiphon can efficiently transfer heat over a much wider temperature range and can typically maintain the processor temperature 10–20 °C cooler than a traditional heat sink and fan.
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