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The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
Even with a common heat sink and fan attached, typical processor operating temperatures may still reach up to 70 °C (160 °F). A thermosiphon can efficiently transfer heat over a much wider temperature range and can typically maintain the processor temperature 10–20 °C cooler than a traditional heat sink and fan.
A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
A multi-surface cooler is a sub-type of passive cooler. It allows airflow both between the laptop base and cooler, and between the base of the cooler and the user's lap. These laptop coolers are suitable for laptops that have vents on the underside. The multi-surface cooling design typically works on any surface without blocking any vents.
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...
Winter tires stay grippy at lower temperatures than the so-called ‘all season’ tires most people use year-round. Result: better steering and braking.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).