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Qimonda produced computing and consumer DRAM, graphics RAM, mobile RAM and Flash memory. [3] Qimonda was primarily reliant on its Deep Trench technology in comparison to the stack capacitor systems of its rival manufacturers. [4] Deep Trench has the benefit of a theoretically smaller footprint than its stack capacitor rival.
The top of the capacitor is connected to the access transistor's drain terminal via a polysilicon strap (Kenner, pp. 42–44). A trench capacitor's depth-to-width ratio in DRAMs of the mid-2000s can exceed 50:1 (Jacob, p. 357). Trench capacitors have numerous advantages.
Ram 5500 tow truck. The Ram Heavy Duty is available in three different configurations: a two-door regular cab with a long bed, a four-door crew cab with either a standard bed or a long bed, or a four-door Mega Cab (a crew cab extended by 11.1 in (280 mm) allowing the rear seats to recline or offering more in-cab storage [2]) with a standard bed.
The Ram 1500 Ramcharger is a plug-in hybrid and extended-range electric vehicle full-size light-duty pickup truck based on the fifth-generation Ram, announced in November 2023. Background [ edit ]
Dodge pioneered the extended-cab pickup with the introduction of the Club Cab for 1973. Available with either a 6.5 ft (2.0 m) or 8 ft (2.4 m) Sweptline bed, the Club Cab was a two-door cab with small rear windows which had more space behind the seats than the standard cab, but was not as long as the four-door crew cab.
The Ram 1500 (DT) is the fifth generation of the Ram Pickup, manufactured by the Ram Trucks division of Stellantis. The fifth generation Ram was introduced in January 2018 at the North American International Auto Show in Detroit , Michigan as a 2019 model year.
The two main types of random-access memory (RAM) are static RAM (SRAM), which uses several transistors per memory cell, and dynamic RAM (DRAM), which uses a transistor and a MOS capacitor per cell. Non-volatile memory (such as EPROM, EEPROM and flash memory) uses floating-gate memory cells, which consist of a single floating-gate transistor per ...
The two most common types of DRAM memory cells since the 1980s have been trench-capacitor cells and stacked-capacitor cells. [25] Trench-capacitor cells are where holes (trenches) are made in a silicon substrate, whose side walls are used as a memory cell, whereas stacked-capacitor cells are the earliest form of three-dimensional memory (3D ...