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FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...
The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.
Phenolic paper is a material often used to make printed circuit board (PCB) substrates (the flat board to which electronic components and traces are attached). It is a very tough board made of wood fibre and phenolic polymers. It is most commonly brown in colour, and is a fibre reinforced plastic.
A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges. Coupons are then inspected to ensure proper layer alignment, electrical connectivity, and cross sectioned to inspect internal ...
Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance. [16] [17]
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo
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