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LGA 1156 (land grid array 1156), also known as Socket H [2] [3] or H1, is an Intel desktop CPU socket. The last processors supporting the LGA 1156 ceased production in 2011. It was succeeded by the mutually incompatible socket LGA 1155. LGA 1156, along with LGA 1366, were designed to replace LGA 775.
This chipset has 20-level programmable interrupt controller a superset of Intel's 82C59 PIC. ... LGA 1200 is a CPU socket designed for Comet Lake and Rocket Lake ...
LGA: 1156 ? 2.5 GT/s DMI bus is a (perhaps modified) PCIe x4 v1.1 interface Socket G34: 2010 AMD Opteron (6000 series) Server LGA: 1974 ? 200–3200 MHz Replaces Socket F: Socket C32: 2010 AMD Opteron (4000 series) Server LGA: 1207 ? 200–3200 MHz Replaces Socket F, Socket AM3: LGA 1567/ Socket LS: 2010 Intel Xeon 6500/7500-series: Server LGA ...
LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture. [2] It is the successor of LGA 1155 and was itself succeeded by LGA 1151 in 2015.
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The Ivy Bridge-EP processor line announced in September 2013 has up to 12 cores and 30 MB third level cache, with rumors of Ivy Bridge-EX up to 15 cores and an increased third level cache of up to 37.5 MB, [45] [46] although an early leaked lineup of Ivy Bridge-E included processors with a maximum of 6 cores. [47]
Other enhancements include Thunderbolt 3.0, Serial ATA Express, Iris Pro graphics with Direct3D feature level 12_1 with up to 128 MB of L4 eDRAM cache on certain SKUs. [56] The Skylake line of processors retires VGA support, [ 57 ] while supporting up to three monitors connected via HDMI 1.4, DisplayPort 1.2 or Embedded DisplayPort (eDP ...
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...