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related to: ion beam applications- Chemical Vapor Deposition
Deposit Conformal Films Without
The Need For High Vacuum Pumps
- Thermal Evaporation
Physical Vapor Deposition Technique
Used To Form Thin Film Coatings
- Magnetron Sputtering
Plasma Based Deposition In Which
Ions Are Accelerated Toward Target
- Ion Beam Processing
This Process Is Critical To High
Performance Thin Film Application
- Chemical Vapor Deposition
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IBA (Ion Beam Applications SA) is a medical technology company based in Louvain-la-Neuve. The company was founded in 1986 by Yves Jongen within the Cyclotron Research Center of the University of Louvain (UCLouvain) and became a university spin-off. It employs about 1500 people in 40 locations. [1]
Ion beam application, etching, or sputtering, is a technique conceptually similar to sandblasting, but using individual atoms in an ion beam to ablate a target. Reactive ion etching is an important extension that uses chemical reactivity to enhance the physical sputtering effect.
Ion beam analysis has found use in a number of variable applications, ranging from biomedical uses to studying ancient artifacts. The popularity of this technique stems from the sensitive data that can be collected without significant distortion to the system on which it is studying.
Focused ion beam, also known as FIB, is a technique used particularly in the semiconductor industry, materials science and increasingly in the biological field for site-specific analysis, deposition, and ablation of materials. A FIB setup is a scientific instrument that resembles a scanning electron microscope (SEM).
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Ion beam deposition (IBD) is a process of applying materials to a target through the application of an ion beam. [1] Ion beam deposition setup with mass separator. An ion beam deposition apparatus typically consists of an ion source, ion optics, and the deposition target. Optionally a mass analyzer can be incorporated. [2] In the ion source ...
Ion-beam lithography, or ion-projection lithography, is similar to Electron beam lithography, but uses much heavier charged particles, ions. In addition to diffraction being negligible, ions move in straighter paths than electrons do both through vacuum and through matter, so there seems be a potential for very high resolution.
While generally less damaging than monotomic sputtering, gas cluster ion sputtering can nevertheless introduce damage that is very noticeable in some materials. [14] A related technique, with a limited range of applications, using high-velocity carbon Fullerenes to treat surfaces, has been studied. [citation needed]
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