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It may be performed with a "bed of nails" test fixture and specialist test equipment, or with a fixtureless in-circuit test setup. In-Circuit Test (ICT) is a widely used and cost-efficient [ 2 ] method for testing medium- to high-volume electronic printed circuit board assemblies (PCBAs).
Side view of a PCB showing a solder bead and test probe. Bead probe technology is a probing method used to connect electronic test equipment to the device under test (DUT) within a bed of nails fixture. The technique was first used in the 1990s [3] and originally given the name “Waygood Bump” after one of the main proponents, Rex Waygood.
Creates constant-amplitude variable frequency sine waves to test frequency response Transistor tester: Tests transistors Tube tester: Tests vacuum tubes (triode, tetrode etc.) Wattmeter: Measures power in a circuit Vectorscope: Displays the phase of the colors in color TV Video signal generator: Generates video signal for testing purposes Voltmeter
Electronic test equipment is used to create signals and capture responses from electronic devices under test (DUTs). In this way, the proper operation of the DUT can be proven or faults in the device can be traced. Use of electronic test equipment is essential to any serious work on electronics systems.
Test fixtures can be set up three different ways: in-line, delegate, and implicit. In-line setup creates the test fixture in the same method as the rest of the test. While in-line setup is the simplest test fixture to create, it leads to duplication when multiple tests require the same initial data.
Automatic test equipment diagnostics is the part of an ATE test that determines the faulty components. ATE tests perform two basic functions. The first is to test whether or not the Device Under Test is working correctly. The second is when the DUT is not working correctly, to diagnose the reason.
Spring loaded pins are a component of the bed of nails tester. A bed of nails tester is a traditional electronic test fixture used for in-circuit testing.It has pins inserted into holes in an epoxy phenolic glass cloth laminated sheet (G-10) which are aligned using tooling pins to make contact with test points on a printed circuit board and are also connected to a measuring unit by wires.
One limitation in flying probe test methods is the speed at which measurements can be taken; the probes must be moved to each new test site on the board, and then a measurement must be completed. Bed-of-nails testers touch each test point simultaneously and electronic switching of instruments between test pins is more rapid than movement of probes.
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