Search results
Results from the WOW.Com Content Network
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
This is a very broad categorization that includes computers with a single microprocessor as their central processing unit (CPU). [2] [6] Personal computer (PC) [1] Desktop computer—see computer form factor for some standardized sizes of desktop computers Full-size; All-in-one; Compact; Home theater; Home computer
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Typical size of a fog, mist, or cloud water droplet 10 μm Width of transistors in the Intel 4004, the world's first commercial microprocessor: 12 μm Width of acrylic fiber: 17-181 μm Width range of human hair [25] 10 −4: 100 μm: 340 μm Size of a pixel on a 17-inch monitor with a resolution of 1024×768 560 μm
typical thermal power, which is measured under normal load (for instance, AMD's average CPU power) maximum thermal power, which is measured under a worst-case load; For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power. When the CPU is idle, it will draw far less than the typical thermal power.
A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes.
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
COM-HPC Size D PICMG: 2020 160 × 160 mm (6.3 × 6.3 in) Used in embedded systems. Requires a carrier board. Typically used for COM-HPC Server Type modules with 4x full size DIMM memory sockets. COM-HPC Size E PICMG: 2020 200 × 160 mm (7.9 × 6.3 in) Used in embedded systems. Requires a carrier board.