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GaN can be doped with silicon (Si) or with oxygen [16] to n-type and with magnesium (Mg) to p-type. [17] [18] However, the Si and Mg atoms change the way the GaN crystals grow, introducing tensile stresses and making them brittle. [19] Gallium nitride compounds also tend to have a high dislocation density, on the order of 10 8 to 10 10 defects ...
The invention of the high-electron-mobility transistor (HEMT) is usually attributed to physicist Takashi Mimura (三村 高志), while working at Fujitsu in Japan. [4] The basis for the HEMT was the GaAs (gallium arsenide) MOSFET (metal–oxide–semiconductor field-effect transistor), which Mimura had been researching as an alternative to the standard silicon (Si) MOSFET since 1977.
Gallium Nitride (GaN) is gaining popularity in high-power applications including power ICs, light-emitting diodes (LEDs), and RF components due to its high strength and thermal conductivity. Compared to silicon, GaN's band gap is more than 3 times wider at 3.4 eV and it conducts electrons 1,000 times more efficiently.
There are many III–V and II–VI compound semiconductors with wide bandgaps. In the III-V semiconductor family, aluminium nitride (AlN) is used to fabricate ultraviolet LEDs with wavelengths down to 200–250 nm, gallium nitride (GaN) is used to make blue LEDs and laser diodes, and boron nitride (BN) is proposed for blue LEDs.
A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).
Wolfspeed, Inc. is an American developer and manufacturer of wide-bandgap semiconductors, focused on silicon carbide and gallium nitride materials and devices for power and radio frequency applications such as transportation, power supplies, power inverters, and wireless systems. The company was formerly named Cree, Inc. [1]
International Rectifier Commences Commercial Shipments of Gallium Nitride on Silicon Devices EL SEGUNDO, Calif.--(BUSINESS WIRE)-- International Rectifier Corporation (NYS: IRF) today announced ...
For example, doping pure silicon with a small amount of phosphorus will increase the carrier density of electrons, n. Then, since n > p, the doped silicon will be a n-type extrinsic semiconductor. Doping pure silicon with a small amount of boron will increase the carrier density of holes, so then p > n, and it will be a p-type extrinsic ...
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