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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The difference can be measured as a difference in voltage potential: the less noble metal is the one with a lower (that is, more negative) electrode potential than the nobler one, and will function as the anode (electron or anion attractor) within the electrolyte device functioning as described above (a galvanic cell).
Some connector styles may combine pin and socket connection types in a single unit, referred to as a hermaphroditic connector. [6]: 56 These connectors includes mating with both male and female aspects, involving complementary paired identical parts each containing both protrusions and indentations. These mating surfaces are mounted into ...
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [16] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
Gold and silver are both precious metal assets worth investing in, but one could be a better bet right now. / Credit: Getty Images/iStockphoto
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...