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  2. Registered memory - Wikipedia

    en.wikipedia.org/wiki/Registered_memory

    Registered (Buffered) DIMM (R-DIMM or RDIMM) modules insert a buffer between the pins of the command and address buses on the DIMM and the memory chips. A high-capacity DIMM might have numerous memory chips, each of which must receive the memory address, and their combined input capacitance limits the speed at which the memory bus can operate.

  3. iPhone X - Wikipedia

    en.wikipedia.org/wiki/IPhone_X

    The iPhone X (Roman numeral "X" pronounced "ten" [13]) is a smartphone that was developed and marketed by Apple Inc. It is part of the 11th generation of the iPhone. Available for pre-order from September 26, 2017, it was released on November 3, 2017. The naming of the iPhone X (skipping the iPhone 9 and 9s) marked the 10th anniversary of the ...

  4. Casual gamers dump 3DS, PSP to hook up with iPhone, Android - AOL

    www.aol.com/2011/11/18/casual-gamers-dump-3ds-psp

    According to a survey released by research firm Cowen and Company, only 26 percent of casual gamers are playing on a Nintendo DS, 3DS or Sony PSP, GamesIndustry.biz reports. By contrast, 52

  5. List of stereoscopic video games - Wikipedia

    en.wikipedia.org/wiki/List_of_stereoscopic_video...

    This is a list of stereoscopic video games.The following article is the list of notable stereoscopic 3D games and related productions and the platforms they can run on. . Additionally, many PC games are supported or are unsupported but capable 3D graphics with AMD HD3D, DDD TriDef, Nvidia 3D Vision, 3DGM, and

  6. R4 cartridge - Wikipedia

    en.wikipedia.org/wiki/R4_cartridge

    R4i Gold 3DS Plus (r4ids.cn) [ edit ] The R4i Gold 3DS Plus from r4ids.cn is notable for featuring a switch inside that cartridge that allows easily switching between being a normal Nintendo DS flashcard and a mode that allows it to be used for the ntrboot exploit for the Nintendo 3DS.

  7. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  8. The Amazon Prime symbol probably doesn't mean what you think ...

    www.aol.com/news/2016-11-17-the-amazon-prime...

    Just because a Prime logo is present, Dimyan says, doesn't mean it's sold by Amazon. In actuality, any of Amazon's 3 million marketplace sellers can use the Amazon warehouse to house and ship ...

  9. Category:Backward-compatible video game consoles - Wikipedia

    en.wikipedia.org/wiki/Category:Backward...

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