enow.com Web Search

Search results

  1. Results from the WOW.Com Content Network
  2. Registered memory - Wikipedia

    en.wikipedia.org/wiki/Registered_memory

    Registered (Buffered) DIMM (R-DIMM or RDIMM) modules insert a buffer between the pins of the command and address buses on the DIMM and the memory chips. A high-capacity DIMM might have numerous memory chips, each of which must receive the memory address, and their combined input capacitance limits the speed at which the memory bus can operate.

  3. iPhone X - Wikipedia

    en.wikipedia.org/wiki/IPhone_X

    The iPhone X (Roman numeral "X" pronounced "ten" [13]) is a smartphone that was developed and marketed by Apple Inc. It is part of the 11th generation of the iPhone. Available for pre-order from September 26, 2017, it was released on November 3, 2017. The naming of the iPhone X (skipping the iPhone 9 and 9s) marked the 10th anniversary of the ...

  4. Force Touch - Wikipedia

    en.wikipedia.org/wiki/Force_Touch

    3D Touch has three settings for input sensitivity. This enables users to customize a preference of light, medium, or firm press on the iPhone's screen. [3] 3D touch gives a continuous pressure reading to software that is running on the phone. Force Touch on the other hand, gives only two layers of interaction: A normal click and a force click.

  5. Nintendo 3DS - Wikipedia

    en.wikipedia.org/wiki/Nintendo_3DS

    The Nintendo 3DS Game Card is a media format used to physically distribute video games for Nintendo 3DS systems. The 3DS Game Card is similar in design to the Nintendo DS Game Card, but includes a small tab on the top left of the card that prevents 3DS Game Cards from being inserted into a Nintendo DS. [105]

  6. Casual gamers dump 3DS, PSP to hook up with iPhone, Android - AOL

    www.aol.com/2011/11/18/casual-gamers-dump-3ds-psp

    According to a survey released by research firm Cowen and Company, only 26 percent of casual gamers are playing on a Nintendo DS, 3DS or Sony PSP, GamesIndustry.biz reports. By contrast, 52

  7. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  8. The Amazon Prime symbol probably doesn't mean what you think ...

    www.aol.com/news/2016-11-17-the-amazon-prime...

    Just because a Prime logo is present, Dimyan says, doesn't mean it's sold by Amazon. In actuality, any of Amazon's 3 million marketplace sellers can use the Amazon warehouse to house and ship ...

  9. Category:Backward-compatible video game consoles - Wikipedia

    en.wikipedia.org/wiki/Category:Backward...

    Help; Learn to edit; Community portal; Recent changes; Upload file; Special pages