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  2. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Copper thickness of PCBs can be specified directly or as the weight of copper per area (in ounce per square foot) which is easier to measure. One ounce per square foot is 1.344 mils or 34 micrometers thickness. Heavy copper is a layer exceeding three ounces of copper per ft 2, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. Heavy ...

  4. Copper foil - Wikipedia

    en.wikipedia.org/wiki/Copper_foil

    Electrodeposited copper foil, also known as electrolytic copper foil, is produced by electroplating copper onto a rolling drum in a highly controlled manner. This type of copper foil has uniform thickness and excellent electrical conductivity, making it ideal for high-performance electronic applications.

  5. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode.CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. [3]

  6. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  7. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo

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