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Ammonium hexachloroplatinate is used in platinum plating. Heating (NH 4) 2 [PtCl 6] under a stream of hydrogen at 200 °C produces platinum sponge. Treating this with chlorine gives H 2 [PtCl 6]. [2] Ammonium hexachloroplatinate decomposes to yield platinum sponge when heated to high temperatures: [2] [5] 3(NH 4) 2 PtCl 6 → 3Pt(s) + 2NH 4 Cl ...
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
Brush electroplating has several advantages over tank plating, including portability, the ability to plate items that for some reason cannot be tank plated (one application was the plating of portions of very large decorative support columns in a building restoration), low or no masking requirements, and comparatively low plating solution ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
We also know that George Richards Elkington (1801–1865), otherwise known for his patent for galvanic gilding and silver plating from 1840 patented at least one process of electrochemical coloring of metals (the American J.E .Stareck developed ten variants of his process around 1937). [10]
Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
It is used when observing a physical process, to record actions as they happen, and thus get an accurate description of the process. It is used when analyzing the steps in a process, to help identify and eliminate waste—thus, it is a tool for efficiency planning. It is used when the process is mostly sequential, containing few decisions.
A process flow diagram (PFD) is a diagram commonly used in chemical and process engineering to indicate the general flow of plant processes and equipment. The PFD displays the relationship between major equipment of a plant facility and does not show minor details such as piping details and designations.
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