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Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
Soldering torches are often powered by butane [20] and are available in sizes ranging from very small butane/oxygen units suitable for very fine but high-temperature jewelry work, to full-size oxy-fuel torches suitable for much larger work such as copper piping. Common multipurpose propane torches, the same kind used for heat-stripping paint ...
The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion. While solder paste can be manufactured using any size range, there has been a move towards finer particle sizes, especially for fine feature stencil ...
A soldering iron stand keeps the iron away from flammable materials, and often also comes with a cellulose sponge and flux pot for cleaning the tip. Some soldering irons for continuous and professional use come as part of a soldering station, which allows the exact temperature of the tip to be adjusted, kept constant, and sometimes displayed.
Flux in the wave soldering process has a primary and a secondary objective. The primary objective is to clean the components that are to be soldered, principally any oxide layers that may have formed. [3] There are two types of flux, corrosive and noncorrosive. Noncorrosive flux requires precleaning and is used when low acidity is required.
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
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Absorbed glycols from flux residues aggravate the problem. The difference in thermal expansion of the fibers and the matrix weakens the bond when the board is soldered; the lead-free solders which require higher soldering temperatures increase the occurrence of CAFs.
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