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  2. Plasma cutting - Wikipedia

    en.wikipedia.org/wiki/Plasma_cutting

    Plasma cutting. Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops ...

  3. Plasma electrolytic oxidation - Wikipedia

    en.wikipedia.org/wiki/Plasma_electrolytic_oxidation

    Plasma electrolytic oxidation (PEO), also known as electrolytic plasma oxidation (EPO) or microarc oxidation (MAO), is an electrochemical surface treatment process for generating oxide coatings on metals. It is similar to anodizing, but it employs higher potentials, so that discharges [1] occur and the resulting plasma modifies the structure of ...

  4. Plasma torch - Wikipedia

    en.wikipedia.org/wiki/Plasma_torch

    Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]

  5. Inductively coupled plasma - Wikipedia

    en.wikipedia.org/wiki/Inductively_coupled_plasma

    Fig. 2. The construction of Inductively Coupled Plasma torch. [3] A: cooling gas tangential flow to the outer quartz tube B: discharge gas flow (usually Ar) C: flow of carrier gas with sample D: induction coil which forms the strong magnetic field inside the torch E: force vectors of the magnetic field F: the plasma torch (the discharge).

  6. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

  7. High-power impulse magnetron sputtering - Wikipedia

    en.wikipedia.org/wiki/High-power_impulse...

    High-power impulse magnetron sputtering (HIPIMS or HiPIMS, also known as high-power pulsed magnetron sputtering, HPPMS) is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely high power densities of the order of kW⋅cm −2 in short pulses (impulses) of tens of ...

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