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LM317 with heat sink. The LM317 is an adjustable positive linear voltage regulator. It was designed by Bob Dobkin in 1976 while he worked at National Semiconductor. [1] The LM337 is the negative complement to the LM317, which regulates voltages below a reference. It was designed by Bob Pease, who also worked for National Semiconductor. [1]
LM393 differential comparator manufactured by National Semiconductor. The following is a list of LM-series integrated circuits. Many were among the first analog integrated circuits commercially produced since late 1965; [1] some were groundbreaking innovations [opinion]. As of 2007, many are still being used. [2]
Single-chip AM radio integrated circuit from 1972. LM317: Adjustable 1.5 A positive voltage regulator (1.25 V-37 V) [8] LM13700: Two current controlled operational transconductance amplifiers (OTA), each having differential inputs and a push-pull output. LM393 No Dual Differential Comparator [9] LM358: No Low power, wide supply range dual op ...
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Parts in this section have a pin count of 14 pins or more. The lower part numbers were established in the 1960s and 1970s, then higher part numbers were added incrementally over decades. IC manufacturers continue to make a core subset of this group, but many of these part numbers are considered obsolete and no longer manufactured.
Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011 [110] Chips using 24–28 nm technology
By adding another circuit element to a fixed voltage IC regulator, it is possible to adjust the output voltage. Two example methods are: A Zener diode or resistor may be added between the IC's ground terminal and ground. Resistors are acceptable where ground current is constant, but are ill-suited to regulators with varying ground current.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.