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This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit ... Die size: 250.04 mm 2, 3.1 billion transistors [53]
Average feature size of components of the GPU. Transistors – Number of transistors on the die. Die size – Physical surface area of the die. Core config – The layout of the graphics pipeline, in terms of functional units. Core clock – The reference base and boost (if available) core clock frequency. Fillrate
List of AMD processors with 3D graphics; ... List of Intel CPU microarchitectures; Comparison of Intel processors This page was last edited on 14 January 2024 ...
Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit and 3D integrated graphics processing unit (IGPU) on a single die.
The following table shows features of AMD's processors with 3D graphics, including APUs (see also: List of AMD processors with 3D graphics ...
Specifications of Intel HD Graphics series [48] [49] Graphics Launch Market Processor Code name Device ID [3] Clock rate Core config 1 API support [13] [33] [50] [51] [52] eDRAM Memory bandwidth Direct3D OpenGL OpenCL Vulkan; HD Graphics 2015 Ultramobile Atom x5-Z8300 Cherryview Braswell (Gen8LP) 22B0 22B1 22B2 22B3 200-500 96:12:2 11.2 4.3 Windows
Average feature size of components of the processor. Bus interface – Bus by which the graphics processor is attached to the system (typically an expansion slot, such as PCI, AGP, or PCI-Express). Memory – The amount of graphics memory available to the processor. SM Count – Number of streaming multiprocessors. [1]