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Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a ...
In conventional anodizing, this layer of oxide is grown on the surface of the metal by the application of electrical potential, while the part is immersed in an acidic electrolyte. In plasma electrolytic oxidation, higher potentials are applied. For example, in the plasma electrolytic oxidation of aluminum, at least 200 V must be applied.
Aluminium oxide (or aluminium(III) oxide) is a chemical compound of aluminium and oxygen with the chemical formula Al 2 O 3. It is the most commonly occurring of several aluminium oxides, and specifically identified as aluminium oxide. It is commonly called alumina and may also be called aloxide, aloxite, or alundum in various forms and ...
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
The melting point of aluminium oxide is 2050°C (2323K), much higher than pure aluminium's 658°C (931K). [6] This and the insulativity of aluminium oxide can make welding more difficult. In typical commercial aluminium anodizing processes, the aluminium oxide is grown down into the surface and out from the surface by equal amounts. [ 7 ]
Anodic aluminum oxide, anodic aluminum oxide (AAO), or anodic alumina is a self-organized form of aluminum oxide that has a honeycomb-like structure formed by high density arrays of uniform and parallel pores. The diameter of the pores can be as low as 5 nanometers and as high as several hundred nanometers, and length can be controlled from few ...
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]
Alonizing is a diffusion metallizing process in that it is a thermochemical treatment that involves enriching the surface layer of an object with one or more metallic elements. [1] Specifically, alonizing is the diffusion of aluminum into the surface of a base metal through high temperature vapors. [2]