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In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner.. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection.
This mechanism allows portable heat wraps to maintain their heat for the entire 90-minute application, compared to conventional silicate-gel hot packs that start to lose heat at 15–20 minutes. Similar to silicate-gel hot packs, the average temperature increase of the paraspinal muscles is 2.2°C, at 1.5cm depth and 1.1°C at 2cm.
A heating pad is a pad used for warming of parts of the body in order to manage pain. Localized application of heat causes the blood vessels in that area to dilate, enhancing perfusion to the targeted tissue. Types of heating pads include electrical, chemical and hot water bottles. Specialized heating pads (mats) are also used in other settings.
Description: Assyrian cuneiform U12047 MesZL 121 or U12226 MesZL 120 or U1244F MesZL 122: Date: February 2017 (font version); April 2017 (SVG file) Source
Description: Assyrian cuneiform U12145 MesZL 136 In w:Amarna letters, iq (cuneiform), and more common in w:Epic of Gilgamesh, ik (cuneiform).: Date: February 2017 (font version); April 2017 (SVG file)
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