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  2. Etching - Wikipedia

    en.wikipedia.org/wiki/Etching

    ferric chloride may be used for etching copper or zinc plates, whereas nitric acid may be used for etching zinc or steel plates. Typical solutions are 1 part FeCl 3 to 1 part water and 1 part nitric to 3 parts water. The strength of the acid determines the speed of the etching process. The etching process is known as biting (see also spit ...

  3. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...

  4. Chemical milling - Wikipedia

    en.wikipedia.org/wiki/Chemical_milling

    A high-purity (≥99.9998%) aluminium bar that has been etched to reveal the component crystallites. Chemical milling or industrial etching is the subtractive manufacturing process of using baths of temperature-regulated etching chemicals to remove material to create an object with the desired shape. [1][2] Other names for chemical etching ...

  5. Copper interconnects - Wikipedia

    en.wikipedia.org/wiki/Copper_interconnects

    Copper interconnects. In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower ...

  6. Ammonium persulfate - Wikipedia

    en.wikipedia.org/wiki/Ammonium_persulfate

    Illustrative of its powerful oxidizing properties, ammonium persulfate is used to etch copper on printed circuit boards as an alternative to ferric chloride solution. [1] [6] This property was discovered many years ago. In 1908, John William Turrentine used a dilute ammonium persulfate solution to etch copper.

  7. Metal assisted chemical etching - Wikipedia

    en.wikipedia.org/.../Metal_assisted_chemical_etching

    Metal Assisted Chemical Etching (also known as MACE) is the process of wet chemical etching of semiconductors (mainly silicon) with the use of a metal catalyst, usually deposited on the surface of a semiconductor in the form of a thin film or nanoparticles. The semiconductor, covered with the metal is then immersed in an etching solution ...

  8. Buffered oxide etch - Wikipedia

    en.wikipedia.org/wiki/Buffered_oxide_etch

    Buffered oxide etch (BOE), also known as buffered HF or BHF, is a wet etchant used in microfabrication. It is a mixture of a buffering agent, such as ammonium fluoride NH4F, and hydrofluoric acid (HF). Its primary use is in etching thin films of silicon nitride (Si 3 N 4) or silicon dioxide (SiO 2), by the reaction: SiO2 + 4HF + 2NH4F → (NH4 ...

  9. Photochemical machining - Wikipedia

    en.wikipedia.org/wiki/Photochemical_machining

    Photochemical machining. Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an offshoot of the printed circuit board industry.

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