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Many RTD elements consist of a length of fine wire wrapped around a heat-resistant ceramic or glass core but other constructions are also used. The RTD wire is a pure material, typically platinum (Pt), nickel (Ni), or copper (Cu). The material has an accurate resistance/temperature relationship which is used to provide an indication of temperature.
Minco is a privately owned company with over 650 employees worldwide. Based in Fridley, Minnesota, the company designs and manufactures flexible printed circuit boards and interconnects, RTD based temperature sensors and assemblies, and thermal solutions for medical, defense, aerospace, industrial, and food service applications.
These resistors are designed to withstand unusually high temperatures of up to 450 °C. [3] Wire leads in low power wirewound resistors are usually between 0.6 and 0.8 mm in diameter and tinned for ease of soldering. For higher power wire-wound resistors, either a ceramic outer case or an aluminum outer case on top of an insulating layer is used.
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
Like the BaTiO 3 thermistor, this device has a highly nonlinear resistance/temperature response useful for thermal or circuit control, not for temperature measurement. Besides circuit elements used to limit current, self-limiting heaters can be made in the form of wires or strips, useful for heat tracing. PTC thermistors "latch" into a hot ...
Four-point measurement of resistance between voltage sense connections 2 and 3. Current is supplied via force connections 1 and 4. In electrical engineering, four-terminal sensing (4T sensing), 4-wire sensing, or 4-point probes method is an electrical impedance measuring technique that uses separate pairs of current-carrying and voltage-sensing electrodes to make more accurate measurements ...
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In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]
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