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The first batches of Araldite epoxy resins, for which the brand is best known, were made in Duxford, England in 1950. [1] Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2]
The mixture sets in 4-6 hours and fully cures in up to 15 hours. It can be used as an adhesive, laminate, plug, filler, sealant, or electrical insulator and can be drilled, ground, tapped, machined, sanded, and painted when cured. J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C).
Liquid versions of hide glue are now available; typically they have urea added to keep the glue liquid at room temperature and to extend drying time. Examples of liquid hide glue are Old Brown Glue or Titebond Liquid Hide. Hide glue does not creep. Hide glue joints are easy to repair, by just heating and adding more hide glue. [7] [8] [9]
The result was Aerolite, a urea-formaldehyde adhesive which unlike conventional glues of the time, resisted water and micro-organisms. Further research showed that gap-bridging hardeners incorporating formic acid enabled Aerolite to be used as an assembly adhesive. Aerolite was the first adhesive of its type to be invented and manufactured in ...
Copper has a very linear resistance–temperature relationship; however, copper oxidizes at moderate temperatures and cannot be used over 150 °C (302 °F). [citation needed] The significant characteristic of metals used as resistive elements is the linear approximation of the resistance versus temperature relationship between 0 and 100 °C.
Depending on the chemical basis, some adhesive types have limited thermal and chemical resistance and the mechanical properties of the bond are temperature dependent. Therefore, choose a type of adhesive that has been developed to have good thermal and chemical resistance, such as reactive hot melt adhesives.
Aluminum oxide, boron nitride, zinc oxide, diamond and increasingly aluminum nitride are used as fillers for these types of adhesives. The filler loading can be as high as 70–80% by mass, and raises the thermal conductivity of the base matrix from 0.17–0.3 W/(m·K) (watts per meter-kelvin) [1] up to about 4 W/(m·K), according to a 2008 ...
The bonding temperature is lower than with most other HMAs, only about 50 °C (122 °F) to 70 °C (158 °F), when the adhesive behaves as a soft rubber acting as a pressure-sensitive adhesive. The surface wetting in this amorphous state is good, and on cooling the polymer crystallizes, forming a strong flexible bond with high cohesion.