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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

  3. In-circuit testing - Wikipedia

    en.wikipedia.org/wiki/In-circuit_testing

    A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.

  4. Flatpack (electronics) - Wikipedia

    en.wikipedia.org/wiki/Flatpack_(electronics)

    A flatpack integrated circuit on a circuit board, among TO-5 packages. The original flatpack was invented by Y. Tao in 1962 while he was working for Texas Instruments to improve heat dissipation. The dual in-line package was invented two years later. The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads. [1]

  5. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    Skinny dual in-line package (SDIP or SPDIP [6]) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600 in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300 mil body ...

  6. Automatic test equipment - Wikipedia

    en.wikipedia.org/wiki/Automatic_test_equipment

    GPIB is a digital 8-bit parallel communications interface capable of achieving data transfers of more than 8 MB/s. It allows daisy-chaining up to 14 instruments to a system controller using a 24-pin connector. It is one of the most common I/O interfaces present in instruments and is designed specifically for instrument control applications.

  7. Zero insertion force - Wikipedia

    en.wikipedia.org/wiki/Zero_insertion_force

    Programming device for a PIC microcontroller, with a dual in-line ZIF socket. Standard DIP packages come in a number of widths (measured between pin centers), with 0.3 in (7.62 mm) and 0.6 in (15.24 mm) being the most common. To allow the design of programmers and similar devices that support a range of devices universal test sockets are produced.

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