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  2. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    This mini environment is within an EFEM (equipment front end module) [8] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 3 ]

  3. Semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device

    This mini environment is within an EFEM (equipment front end module) [14] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 9 ]

  4. ASM International - Wikipedia

    en.wikipedia.org/wiki/ASM_International

    ASM's products are used by semiconductor manufacturers in front-end wafer processing in their semiconductor fabrication plants. ASM's technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion. [1] The company was founded by Arthur del Prado (1931-2016) as 'Advanced Semiconductor Materials' in 1964. [2]

  5. Front end of line - Wikipedia

    en.wikipedia.org/wiki/Front_end_of_line

    Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]

  6. Mortgage and refinance rates for Dec. 17, 2024: Average ... - AOL

    www.aol.com/finance/mortgage-and-refinance-rates...

    See today's average mortgage rates for a 30-year fixed mortgage, 15-year fixed, jumbo loans, refinance rates and more — including up-to-date rate news.

  7. front end of line (FEoL) – initial wafer processing steps up to (but not including) metal interconnect (see also back end of line, far back end of line, post-fab) heterogeneous integration – combining different types of integrated circuitry into a single device; differences may be in fabrication process, technology node, substrate, or function

  8. Another 1 million not deported because Biden granted ...

    www.aol.com/news/another-1-million-not-deported...

    President-elect Donald Trump has vowed to end TPS, which was established by Congress in the Immigration Act of 1990, which former president George H. W. Bush signed into law.

  9. RF front end - Wikipedia

    en.wikipedia.org/wiki/RF_front_end

    In a radio receiver circuit, the RF front end, short for radio frequency front end, is a generic term for all the circuitry between a receiver's antenna input up to and including the mixer stage. [1] It consists of all the components in the receiver that process the signal at the original incoming radio frequency (RF), before it is converted to ...

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