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  2. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    1/2 oz/ft 2 foil is not widely used as a finished copper weight, but is used for outer layers when plating for through holes will increase the finished copper weight Some PCB manufacturers refer to 1 oz/ft 2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).

  3. Copper foil - Wikipedia

    en.wikipedia.org/wiki/Copper_foil

    Electrodeposited copper foil, also known as electrolytic copper foil, is produced by electroplating copper onto a rolling drum in a highly controlled manner. This type of copper foil has uniform thickness and excellent electrical conductivity, making it ideal for high-performance electronic applications.

  4. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and then populating them with electronic components. It involves the full assembly of a board into a functional circuit board.

  5. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  6. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).

  7. Ounce - Wikipedia

    en.wikipedia.org/wiki/Ounce

    The most common unit of measure for the copper thickness on a printed circuit board (PCB) is ounces (oz), as in mass. It is the resulting thickness when the mass of copper is pressed flat and spread evenly over a one-square-foot area. 1 oz will roughly equal 34.7 μm. [19]

  8. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.

  9. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0 mm. PQFP, or plastic quad flat pack, is a type of QFP, as is the thinner TQFP package. PQFP packages can vary in thickness from 2.0 mm to 3.8 mm.

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