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Copper is commonly used for building wire because of its conductivity, strength, and reliability. Over the life of a building wire system, copper can also be the most economical conductor. Copper used in building wire has a conductivity rating of 100% IACS [ 10 ] [ 25 ] or better.
Very importantly, constantan can be processed for self-temperature compensation to match a wide range of test material coefficients of thermal expansion.A-alloy is supplied in self-temperature-compensation (S-T-C) numbers 00, 03, 05, 06, 09, 13, 15, 18, 30, 40, and 50, for use on test materials with corresponding thermal expansion coefficients, expressed in parts per million by length (or μm ...
Manganin is a trademarked name for an alloy of typically 84.2% copper, 12.1% manganese, and 3.7% nickel. It was first developed by Edward Weston in 1892, improving upon his Constantan (1887). Manganin foil and wire is used in the manufacture of resistors , particularly ammeter shunts , because of its virtually zero temperature coefficient of ...
John Ferreol Monnot, metallurgist, the inventor of the first successful process for manufacturing copper-clad steel. Copper-clad steel (CCS), also known as copper-covered steel or the trademarked name Copperweld is a bi-metallic product, mainly used in the wire industry that combines the high mechanical strength of steel with the conductivity and corrosion resistance of copper.
Sometime around 1913 several copper samples from 14 important refiners and wire manufacturers were analyzed by the U.S. Bureau of Standards. The average resistance of the samples was determined to be 0.15292 Ω for copper wires with a mass of 1 gram of uniform cross section and 1 meter in length at 20 °C. In the United States this is usually ...
The ultimate tensile strength of a material is an intensive property; therefore its value does not depend on the size of the test specimen.However, depending on the material, it may be dependent on other factors, such as the preparation of the specimen, the presence or otherwise of surface defects, and the temperature of the test environment and material.
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