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Hot Form Quench (HFQ) is an aluminum hot stamping process for high strength sheet (typically) 2xxx, 6xxx and 7xxx series alloys, [6] that was initially developed in the early 2000s by Professors Jianguo Lin and Trevor Dean at the University of Birmingham and then at Imperial College London, both in the UK.
Aluminium–scandium alloys (AlSc) are aluminum alloys that consist largely of aluminium (Al) and traces of scandium (Sc) as the main alloying elements.In principle, aluminium alloys strengthened with additions of scandium are very similar to traditional nickel-base superalloys in that both are strengthened by coherent, coarsening resistant precipitates with an ordered L1 2 structure.
Aluminium oxynitride (marketed under the name ALON by Surmet Corporation [3]) is a transparent ceramic composed of aluminium, oxygen and nitrogen.Aluminium oxynitride is optically transparent (≥80% for 2 mm thickness) in the near-ultraviolet, visible, and mid-wave-infrared regions of the electromagnetic spectrum.
For deep draw and complex shapes, and for the avoidance of spring-back, an aluminium hot stamping process (Hot Form Quench) can be used, which forms a blank at a elevated temperature (~ 550 C) in a cooled die, leaving a part in W-temper condition before artificial aging to the T6 full strength state.
7068 alloy is a 7000 series aluminium-zinc alloy registered with the US Aluminium Association and produced to AMS 4331 (chemical composition and mechanical properties) and AMS 2772 (heat treatment). 7068 alloy ‘A’ and ‘B’ tensile data and fatigue properties have been ratified for inclusion in MIL Handbook 5 / MMPDS.
HVAF has a maximum flame temperature of 3,560° to 3,650 °F and an average particle velocity of 3,300 ft/sec. Since the maximum flame temperature is relatively close to the melting point of most spray materials, HVAF results in a more uniform, ductile coating. This also allows for a typical coating thickness of 0.002-0.050".
Therefore, AlN is more advantageous than GaN in terms of heat dissipation in many power and radio frequency electronic devices. Thermal expansivity is another critical property for high temperature applications. The calculated thermal expansion coefficients of AlN at 300 K are 4.2×10 −6 K −1 along a-axis and 5.3×10 −6 K −1 along c ...
At 500 °C it is still 0.8% Si, at 400 °C 0.3% Si and at 250 °C only 0.05% Si. At room temperature, silicon is practically insoluble. Aluminum cannot be dissolved in silicon at all, not even at high temperatures. Only in the molten state are both completely soluble. Increases in strength due to solid solution strengthening are negligible. [7]