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A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Skinny dual in-line package (SDIP or SPDIP [6]) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600 in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300 mil body ...
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Hybrid integrated circuit (National Semiconductor LH033CG) in a variant of the TO-8 package with 12 leads In electronics, TO-8 is a designation for a standardized metal semiconductor package . TO in TO-8 stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC . [ 1 ]
2.5 V or 5 V Zener reference diode with temperature coefficient trimmer [53] LM368 Yes 2.5 V precision voltage reference [54] LM169 LM369 LM199 Yes 2.5 V temperature compensated precision voltage reference [55] LM185 LM285 LM385 Fixed (1.2 V, 2.5 V) or adjustable micropower voltage reference [56] [57] LM129 LM329 LM129
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
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