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An improvement to this method is filing the solder to powder size and mixing it with the flux. The work area is painted with tragacanth and the granules are bedded on this using a fine brush. Having dried, the work is sprinkled with the flux-solder powder and heated to melting point.
Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
High-temperature brazed diamond tools: This tool is made by brazing a single layer of diamonds onto the tool via a solder at a temperature of over 900 °C. using vacuum brazing or atmosphere-protected brazing. This tool has several advantages: the solder can hold the diamonds very firmly, the single layer of diamonds' exposed height can be 70% ...
Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time.
Care had to be taken not to melt the little granules onto the surface but instead, to solder them on with a tiny heated point. The various omissions and imperfections, made on purpose, gave the piece of jewelry the artistic character. Soldering was done using (most likely) arseniates and reducing the solder to an impalpable dust. [1]
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A 2–3 μm layer of gold dissolves completely within one second during typical wave soldering conditions. Layers of gold thinner than 0.5 μm (0.02 thou) also dissolve completely into the solder, exposing the underlying metal (usually nickel) to the solder. Impurities in the nickel layer can prevent the solder from bonding to it.
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