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Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces contact resistance as well as surface hardness. Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin.
The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf/cm or 10 to 60 N/cm or 5 to 35 lbf/in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.
Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]
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Download as PDF; Printable version; In other projects Wikimedia Commons; ... Electroless copper plating; Electroless deposition; Electroless nickel immersion gold;
A cleaning company has been fined $171,000 after federal investigators found 11 children working a "dangerous" overnight shift at a meat processing plant in Iowa. The U.S. Labor Department sa id ...