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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads; TO-226 [23] TO-247: [24] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink; TO-251: [24] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting

  3. Chip carrier - Wikipedia

    en.wikipedia.org/wiki/Chip_carrier

    A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.

  4. Multi-chip module - Wikipedia

    en.wikipedia.org/wiki/Multi-chip_module

    A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...

  5. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Cost is a factor in selection of integrated circuit packaging. Typically, an inexpensive plastic package can dissipate heat up to 2W, which is sufficient for many simple applications, though a similar ceramic package can dissipate up to 50W in the same scenario. [1] As the chips inside the package get smaller and faster, they also tend to get ...

  6. System in a package - Wikipedia

    en.wikipedia.org/wiki/System_in_a_package

    CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.

  7. Tape-automated bonding - Wikipedia

    en.wikipedia.org/wiki/Tape-automated_bonding

    Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.

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