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E.C Electroplating went out of business in 2009, leaving the Superfund site “orphaned” as there was no longer a responsible party to pay for the clean-up. In 2016, the EPA estimated that the cleanup for the E.C Electroplating site and surrounding areas would cost around $37 million. [12] [13]
Superfund sites in New York are designated under the Comprehensive Environmental Response, Compensation, and Liability Act (CERCLA). CERCLA, a federal law passed in 1980, authorized the United States Environmental Protection Agency (EPA) to create a list of polluted locations requiring a long-term response to clean up hazardous material contaminations. [1]
Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.
Such zinc electroplating or zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot-dip galvanization and electroplating. [ 1 ]
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Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
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